Khan, S K and Mandal, S S (1983) Glass-bonded mica-an ideal material for PCB. Transactions of the Indian Ceramic Society, 42 (4). pp. 104-105. ISSN 0371-750X
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Abstract
PCB fabric-ations are, at present, limited within varieties of reinforced plastic laminates. In special cases, ceramic substrates of alumina aud beryllia are also used. Glass-bonded mica also holds a good potentiality as a PCB material, especially in view of a unique combination of mechanical, thermal and electrical desirability and also for low cost of production. An attempt has been made to prepare PCB with glass-bonded material developed at the Institute. © 1983 Taylor & Francis Group, LLC.
| Item Type: | Article |
|---|---|
| Additional Information: | cited By 0 |
| Subjects: | Glass |
| Divisions: | UNSPECIFIED |
| Depositing User: | Bidhan Chaudhuri |
| Date Deposited: | 24 May 2016 06:38 |
| Last Modified: | 24 May 2016 06:38 |
| URI: | http://cgcri.csircentral.net/id/eprint/3380 |
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