Sen, S K and Ghorai, A and Bandyopadhyay, A K and Sen, Suchitra (1987) Interfacial reactions in bimetallic Ag-Sn thin-film couples. Thin Solid Films, 155 (2). pp. 243-253. ISSN 0040-6090

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Abstract

Interfacial reactions in bimetallic Ag-Sn thin film couples have been investigated by measurement of electrical resistance and contact resistance as a function of time and temperature in order to understand kinetic behaviour in the above system where the intermetallic phase y-Ag 3 Sn is formed. Since the reaction is found to start at room temperature, the conventional vacuum coating unit has been modified for preparing such films and conducting subsequent measurements without breaking the vacuum. The results from the above different methods of resistance measurement indicate that interfacial reactions are characterized by a mean diffusion coefficient of l0 13 cm2s 1 at room temperature. X-ray diffraction indicates growth of the y- Ag3Sn phase immediately after deposition. Scanning electron microscopy confirms the diffusion of tin into silver by grain boundary diffusion rather than by bulk diffusion. The results from transmission electron microscopy confirm the presence of a y-Ag 3 Sn phase.

Item Type:	Article
Subjects:	Electronics
Divisions:	UNSPECIFIED
Depositing User:	Bidhan Chaudhuri
Date Deposited:	09 Apr 2015 10:16
Last Modified:	09 Apr 2015 10:16
URI:	http://cgcri.csircentral.net/id/eprint/2802

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